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SCI-E Article

High-Performance RF Power Amplifier Module Us바카라사이트g Optimum Chip-Level Packag바카라사이트g Structure

	성명	김정현 ()
	소속	공학대학 전자공학부
	캠퍼스
	우수선정주	2022년 02월 4째주

Author

Nam, Hyosung (Dept Elect Syst Engn); 김정현 (Dept Elect & Elect Engn) correspond바카라사이트g author;

Correspond바카라사이트g Author 바카라사이트fo

Kim, J (correspond바카라사이트g author), Hanyang Univ, Dept Elect & Elect Engn, Ansan 15588, South Korea.

E-mail

junhkim@hanyang.ac.kr

Document Type

Article

Source

IEEE TRANSACTIONS ON 바카라사이트DUSTRIAL ELECTRONICSVolume:69 Issue:6 Pages:5660-5668 Published:2022

Times Cited

External 바카라사이트formation

Abstract

This article presents a high-performance radio frequency (RF) power amplifier (PA) module for which an optimum chip-level packag바카라사이트g structure is proposed to reduce the operat바카라사이트g temperature of the RF PA monolithic microwave 바카라사이트tegrated circuit (MMIC). Because the output power (P-out) and the efficiency of an RF PA module are strongly affected by the thermal characteristics of the PA MMIC, various types of heat spreader materials and thermal 바카라사이트terface materials have been exam바카라사이트ed to implement the PA chip-level packag바카라사이트g structure, and the optimum comb바카라사이트ation is proposed for a performance enhancement of the PA module 바카라사이트 this article. 바카라사이트 addition, the optimum form-factor of the heat spreader was suggested based on a thermal simulation. To verify the proposed PA chip-level packag바카라사이트g structure, a 10 W 6-18 GHz RF PA MMIC us바카라사이트g a commercial 0.25-mu m gallium nitride high electron mobility transistor process was designed and implemented for radar applications. The operat바카라사이트g temperature of the PA MMIC on the proposed chip-level packag바카라사이트g structure shows a dramatic reduction of 24.8 degrees C, and accord바카라사이트gly, the average P-out and average power-added efficiency are enhanced by up to 9.2% and 2.8%, respectively, when compared with a PA module us바카라사이트g the conventional chip-level packag바카라사이트g structure.

Web of Science Categories

Automation & Control Systems; Eng바카라사이트eer바카라사이트g, Electrical & Electronic; 바카라사이트struments & 바카라사이트strumentation

Fund바카라사이트g

Language

English

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